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- Length:
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- Attachment Method:
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- Package Cooled:
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- Material Finish:
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- Electus conditionibus;
Odonata Lepidoptera products 4
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | ||
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | ||
Wakefield-Vette |
Quaestiones
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM BLACK SMD
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218 | Top Mount | Copper | 0.320" (8.13mm) | 0.900" (22.86mm) | - | SMD Pad | SMD | 0.400" (10.16mm) | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | Tin | ||||
Wakefield-Vette |
Quaestiones
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK ALUM NATURAL SMD
|
218 | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | SMD | 0.400" (10.16mm) | 2.3W @ 40°C | 5.00°C/W @ 600 LFM | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
|
- | Top Mount | Aluminum | 1.000" (25.40mm) | 0.830" (21.08mm) | 0.316" (8.03mm) ID | Press Fit | TO-5 | 0.395" (10.03mm) | 0.6W @ 20°C | 20.00°C/W @ 400 LFM | Black Anodized | ||||
CTS Thermal Management Products |
Quaestiones
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK VERT W/TABS BLK TO-220
|
7 | Board Level, Vertical | Aluminum | 1.250" (31.75mm) | 0.875" (22.22mm) | - | Bolt On and PC Pin | TO-220 | 0.250" (6.35mm) | 3.0W @ 80°C | - | Black Anodized |