- Material：
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- Length：
-
- Width：
-
- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Electus conditionibus;
Odonata Lepidoptera products 15
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,250
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,300
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,300
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
16,283
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D2PAK
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | Tin | ||
|
|
|
Ohmite |
1,270
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK BLACK ANODIZED
|
CSM | Board Level, Vertical | Aluminum | 0.472" (12.00mm) | 0.492" (12.50mm) | Solderable Feet | TO-220 | 1.228" (31.20mm) | 2.0W @ 44°C | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
2,297
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.031" (26.20mm) | - | TO-263 (D2Pak) | 0.402" (10.21mm) | - | 9.50°C/W @ 200 LFM | Tin | |||
|
|
|
ASSMANN WSW Components |
1,935
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ANOD ALUM SOT-32/TO-220
|
- | Board Level, Vertical | Aluminum | 1.189" (30.20mm) | 1.000" (25.40mm) | Bolt On and Board Mounts | SOT-32, TO-220 | 0.315" (8.00mm) | - | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
2,750
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.031" (26.20mm) | - | TO-263 (D2Pak) | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | Tin | |||
|
|
Advanced Thermal Solutions Inc. |
2,833
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.031" (26.20mm) | - | TO-263 (D2Pak) | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | Tin | |||
|
|
Advanced Thermal Solutions Inc. |
2,833
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | Top Mount | Copper | 0.500" (12.70mm) | 1.031" (26.20mm) | - | TO-263 (D2Pak) | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | Tin | |||
|
|
Advanced Thermal Solutions Inc. |
1,490
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB BLACK
|
- | Board Level, Vertical | Aluminum | 1.380" (35.05mm) | 1.000" (25.40mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | - | 13.00°C/W @ 200 LFM | Black Anodized | |||
|
|
|
ASSMANN WSW Components |
635
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Aluminum | 1.189" (30.20mm) | 1.000" (25.40mm) | Bolt On | SOT-32, TO-220 | 0.311" (7.90mm) | - | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 COPPER W/TAB
|
- | Board Level, Vertical | Copper | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On and Board Mounts | TO-220 | 0.500" (12.70mm) | - | 13.00°C/W @ 200 LFM | Tin | |||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | Tin |
