Odonata Lepidoptera products 10
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Type Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
533402B02552G
Aavid, Thermal Division of Boyd Corporation
4,336
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 SOLDERPIN/CLIP
- Board Level, Vertical 1.500" (38.10mm) 1.650" (41.91mm) Clip and PC Pin TO-220 1.000" (25.40mm) 8.0W @ 40°C 2.00°C/W @ 500 LFM
V8813X
ASSMANN WSW Components
1,723
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-220/TOP-3/SOT-32
- Board Level, Vertical 1.496" (38.00mm) 1.359" (34.50mm) Bolt On and PC Pin SOT-32, TO-220, TOP-3 0.492" (12.50mm) - -
529801B02500G
Aavid, Thermal Division of Boyd Corporation
3,120
III dies
-
MOQ: 1  MPQ: 1
HEATSINK TO-218 W/PINS 1.5"TALL
- Board Level, Vertical 1.500" (38.10mm) 1.650" (41.91mm) Bolt On and PC Pin TO-218 1.000" (25.40mm) 10.0W @ 50°C 2.00°C/W @ 500 LFM
7-342-2PP-BA
CTS Thermal Management Products
1,553
III dies
-
MOQ: 1  MPQ: 1
HEATSINK HORZ SIX BLACK TO-220
7 Board Level 1.500" (38.10mm) 1.642" (41.70mm) Bolt On TO-220 0.690" (17.53mm) 9.0W @ 40°C -
V5512W
ASSMANN WSW Components
96
III dies
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- Board Level 0.591" (15.01mm) 2.756" (70.00mm) Bolt On TO-220, TOP-3 0.984" (25.00mm) - -
WA-DT2-101E
Ohmite
92
III dies
-
MOQ: 1  MPQ: 1
HEATSINK DUAL FOR TO-220/247 BLK
W Board Level, Vertical 1.200" (30.48mm) 1.710" (43.43mm) Clip and PC Pin TO-220, TO-247 (Dual) 0.630" (16.00mm) 4.0W @ 40°C 6.00°C/W @ 200 LFM
V8511X
ASSMANN WSW Components
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- Board Level, Vertical 1.500" (38.10mm) 1.638" (41.60mm) Bolt On and PC Pin SOT-32, TO-220, TOP-3 0.984" (25.00mm) - -
529801B00000
Aavid, Thermal Division of Boyd Corporation
Quaestiones
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Board Level 1.500" (38.10mm) 1.650" (41.91mm) Bolt On TO-218 1.000" (25.40mm) 5.0W @ 30°C 3.00°C/W @ 200 LFM
529801B02100G
Aavid, Thermal Division of Boyd Corporation
Quaestiones
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Board Level, Vertical 1.500" (38.10mm) 1.650" (41.91mm) Bolt On and PC Pin TO-218 1.000" (25.40mm) 5.0W @ 30°C 3.00°C/W @ 200 LFM
533402B02500G
Aavid, Thermal Division of Boyd Corporation
Quaestiones
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Board Level, Vertical 1.500" (38.10mm) 1.650" (41.91mm) Bolt On and PC Pin TO-220 1.000" (25.40mm) 10.0W @ 50°C 3.00°C/W @ 200 LFM