- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Electus conditionibus;
Odonata Lepidoptera products 8
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
|
|
Wakefield-Vette |
1,661
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
|
657 | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | 3.30°C/W @ 200 LFM | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,586
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 1.75" HIGH RISE TO-220
|
- | 1.750" (44.45mm) | 0.750" (19.05mm) | Clip and Board Mounts | TO-220 | 1.750" (44.45mm) | 4.0W @ 30°C | 2.00°C/W @ 400 LFM | ||
|
|
|
Wakefield-Vette |
971
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
|
657 | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | 3.30°C/W @ 200 LFM | ||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 HIGH RISE
|
- | 1.760" (44.70mm) | 0.697" (17.70mm) | Clip and Board Mounts | TO-220 | 1.772" (45.00mm) | - | 2.70°C/W @ 200 LFM | |||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 1.840" (46.74mm) | 0.490" (12.44mm) | Bolt On and PC Pin | TO-220, TO-247 | 1.750" (44.45mm) | 4.0W @ 30°C | 1.00°C/W @ 700 LFM | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 1.840" (46.74mm) | 0.490" (12.44mm) | Bolt On and PC Pin | TO-218, TO-247 | 1.750" (44.45mm) | 4.0W @ 30°C | 1.00°C/W @ 700 LFM | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 1.840" (46.74mm) | 0.490" (12.44mm) | Clip and PC Pin | TO-218, TO-247 | 1.750" (44.45mm) | 4.0W @ 30°C | 1.00°C/W @ 700 LFM | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
|
657 | 1.000" (25.40mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-218, TO-220, TO-247 | 1.500" (38.10mm) | 6.0W @ 38°C | 3.30°C/W @ 200 LFM |
