- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Electus conditionibus;
Odonata Lepidoptera products 2
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Quaestiones
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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0.915" (23.24mm) | 1.5W @ 40°C | 6.00°C/W @ 600 LFM | 16.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
0.845" (21.46mm) | 2.0W @ 50°C | 6.00°C/W @ 400 LFM | 20.60°C/W |
