- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 5
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
ASSMANN WSW Components |
18,400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
- | 0.790" (20.07mm) | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | ||
|
|
|
ASSMANN WSW Components |
18,715
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
- | 0.790" (20.07mm) | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | ||
|
|
|
ASSMANN WSW Components |
18,715
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
- | 0.790" (20.07mm) | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | ||
|
|
|
ASSMANN WSW Components |
430
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
- | 0.790" (20.07mm) | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM BLACK SMD
|
218 | 0.900" (22.86mm) | SMD | 0.400" (10.16mm) | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | 31.00°C/W |
