- Type：
-
- Material：
-
- Length：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 7
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
ASSMANN WSW Components |
3,125
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ANOD ALUM TO-220
|
- | Top Mount | Aluminum | 0.787" (20.00mm) | TO-220 | 0.472" (12.00mm) | - | - | 12.00°C/W | ||
|
|
|
ASSMANN WSW Components |
382
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ANOD ALUM
|
- | Board Level | Aluminum | 1.476" (37.50mm) | KLP | 0.472" (12.00mm) | - | - | 11.00°C/W | ||
|
|
|
ASSMANN WSW Components |
373
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Aluminum | 1.969" (50.00mm) | KLP | 0.453" (11.50mm) | - | - | 10.00°C/W | ||
|
|
|
ASSMANN WSW Components |
450
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Aluminum | 1.476" (37.50mm) | KLP | 0.472" (12.00mm) | - | - | 13.00°C/W | ||
|
|
|
ASSMANN WSW Components |
523
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Aluminum | 1.476" (37.50mm) | KLM | 0.472" (12.00mm) | - | - | 13.00°C/W | ||
|
|
|
ASSMANN WSW Components |
76
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Aluminum | 0.787" (20.00mm) | TO-220 | 0.472" (12.00mm) | - | - | 15.00°C/W | ||
|
|
|
CUI Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 35
|
HSE | Board Level | Aluminum Alloy | 1.378" (35.00mm) | TO-220 | 0.472" (12.00mm) | 6.2W @ 75°C | 2.91°C/W @ 200 LFM | 12.10°C/W |
