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- Material：
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- Shape：
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- Length：
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- Width：
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- Diameter：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Electus conditionibus;
Odonata Lepidoptera products 1,372
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Diameter | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
ASSMANN WSW Components |
25,551
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ANOD ALUM CPU
|
- | Top Mount | Aluminum | Square, Pin Fins | 0.393" (10.00mm) | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.275" (7.00mm) | - | - | 31.00°C/W | Black Anodized | ||
|
|
|
Advanced Thermal Solutions Inc. |
2,488
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK FOR TI MOD #TPA3130D
|
- | - | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,806
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PIN-FIN W/TAPE
|
- | - | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
|
Wakefield-Vette |
621
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATPIPE SINTERED 6X0.3X100MM
|
- | Heat Pipe | Copper | Round | 3.937" (100.00mm) | - | 0.236" (6.00mm) OD | - | - | - | - | - | - | ||
|
|
|
t-Global Technology |
5,067
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 10X10X2MM
|
XL-25 | Heat Spreader | Ceramic | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | - | - | ||
|
|
|
t-Global Technology |
5,198
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 20X20X2MM
|
XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,635
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 STAGGEREDFIN TIN
|
- | - | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
|
Wakefield-Vette |
2,089
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS BLK 1.5"
|
- | - | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
|
Wakefield-Vette |
1,943
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS
|
667 | - | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
Advanced Thermal Solutions Inc. |
664
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FLAT HEATPIPE 70W 3X8X100MM
|
- | Heat Pipe | Copper | Flat | 3.937" (100.00mm) | 0.315" (8.00mm) | - | - | 0.118" (3.00mm) | - | - | - | - | |||
|
|
Advanced Thermal Solutions Inc. |
560
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FLAT HEATPIPE 60W 3X8X150MM
|
- | Heat Pipe | Copper | Flat | 5.906" (150.00mm) | 0.315" (8.00mm) | - | - | 0.118" (3.00mm) | - | - | - | - | |||
|
|
Advanced Thermal Solutions Inc. |
205
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FLAT HEATPIPE 40W 2.5X8.2X150MM
|
- | Heat Pipe | Copper | Flat | 5.906" (150.00mm) | 0.323" (8.20mm) | - | - | 0.098" (2.50mm) | - | - | - | - | |||
|
|
Advanced Thermal Solutions Inc. |
127
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FLAT HEATPIPE 35W 2.5X8.2X200MM
|
- | Heat Pipe | Copper | Flat | 7.874" (200.00mm) | 0.323" (8.20mm) | - | - | 0.098" (2.50mm) | - | - | - | - | |||
|
|
Advanced Thermal Solutions Inc. |
120
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FLAT HEATPIPE 50W 3X8X200MM
|
- | Heat Pipe | Copper | Flat | 7.874" (200.00mm) | 0.315" (8.00mm) | - | - | 0.118" (3.00mm) | - | - | - | - | |||
|
|
Advanced Thermal Solutions Inc. |
190
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FLAT HEATPIPE 70W 4.5X10.5X150MM
|
- | Heat Pipe | Copper | Flat | 5.906" (150.00mm) | 0.413" (10.50mm) | - | - | 0.177" (4.50mm) | - | - | - | - | |||
|
|
Advanced Thermal Solutions Inc. |
145
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FLAT HEATPIPE 65W 3.5X11.2X150MM
|
- | Heat Pipe | Copper | Flat | 5.906" (150.00mm) | 0.441" (11.20mm) | - | - | 0.138" (3.50mm) | - | - | - | - | |||
|
|
Advanced Thermal Solutions Inc. |
215
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FLAT HEATPIPE 70W 4.5X10.5X250MM
|
- | Heat Pipe | Copper | Flat | 9.843" (250.00mm) | 0.413" (10.50mm) | - | - | 0.177" (4.50mm) | - | - | - | - | |||
|
|
Advanced Thermal Solutions Inc. |
143
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FLAT HEATPIPE 65W 3.5X11.2X250MM
|
- | Heat Pipe | Copper | Flat | 9.843" (250.00mm) | 0.441" (11.20mm) | - | - | 0.138" (3.50mm) | - | - | - | - | |||
|
|
|
Advanced Thermal Solutions Inc. |
574
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TI TAS5622 AND TAS5624
|
- | - | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
Advanced Thermal Solutions Inc. |
150
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ROUND HEATPIPE 30W 4X200MM
|
- | Heat Pipe | Copper | Round | 7.874" (200.00mm) | - | 0.157" (4.00mm) OD | - | - | - | - | - | - |
