- Material：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Electus conditionibus;
Odonata Lepidoptera products 3
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
t-Global Technology |
5,198
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 20X20X2MM
|
XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | - | - | ||
|
|
|
t-Global Technology |
813
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 20X20X6MM
|
- | Heat Spreader | Ceramic | Square, Fins | 0.787" (20.00mm) | - | 0.236" (6.00mm) | - | - | - | - | ||
|
|
|
CUI Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4.1W ALUMINUM
|
- | Board Level | Aluminum | Rectangular, Fins | 0.775" (19.68mm) | TO-220 | 0.303" (7.70mm) | 4.1W @ 75°C | 7.05°C/W @ 200 LFM | 18.29°C/W | Black Anodized |
