- Material:
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- Length:
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- Width:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Electus conditionibus;
Odonata Lepidoptera products 9
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Aavid, Thermal Division of Boyd Corporation |
18,195
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.5W LOW PROFILE
|
Board Level | Aluminum | Square, Fins | 0.750" (19.05mm) | 0.750" (19.05mm) | Bolt On | TO-220 | 2.5W @ 60°C | 10.00°C/W @ 200 LFM | 24.00°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
2,884
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 DUAL BLACK
|
Board Level | Aluminum | Rectangular, Fins | 1.470" (37.34mm) | 1.750" (44.45mm) | Bolt On | TO-220 | - | 3.00°C/W @ 200 LFM | 9.60°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TAB FOLD 42.16MM
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 1.450" (36.83mm) | 1.750" (44.45mm) | Bolt On and PC Pin | TO-220 | 6.0W @ 50°C | 4.00°C/W @ 300 LFM | 6.80°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | Rectangular, Fins | 0.620" (15.75mm) | 0.915" (23.24mm) | Clip | Multiwatt, SIP | 1.5W @ 40°C | 6.00°C/W @ 600 LFM | 16.00°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | Rectangular, Fins | 0.620" (15.75mm) | 0.845" (21.46mm) | Clip | Multiwatt, SIP | 2.0W @ 50°C | 6.00°C/W @ 400 LFM | 20.60°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | Rectangular, Fins | 0.900" (22.86mm) | 1.000" (25.40mm) | Bolt On | TO-220 | 2.0W @ 40°C | 4.00°C/W @ 700 LFM | 20.80°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | Rectangular, Fins | 1.450" (36.83mm) | 1.750" (44.45mm) | Bolt On | TO-220 | 6.0W @ 50°C | 4.00°C/W @ 300 LFM | 6.80°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Copper | Rectangular, Fins | 0.795" (20.19mm) | 0.915" (23.24mm) | Clip and PC Pin | Multiwatt, SIP | 1.0W @ 30°C | 6.00°C/W @ 600 LFM | 16.00°C/W | Tin | ||||
Comair Rotron |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 9.7X44.5X36.8MM
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 1.450" (36.83mm) | 1.750" (44.45mm) | Bolt On and PC Pin | TO-220 | 3.0W @ 30°C | 4.00°C/W @ 300 LFM | - | Black Anodized |