- Material：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Material Finish：
-
Odonata Lepidoptera products 2
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Length | Attachment Method | Power Dissipation @ Temperature Rise | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Length | Attachment Method | Power Dissipation @ Temperature Rise | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | 0.620" (15.75mm) | Clip | 1.5W @ 40°C | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Copper | 0.795" (20.19mm) | Clip and PC Pin | 1.0W @ 30°C | Tin |
