- Attachment Method：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
Odonata Lepidoptera products 3
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Length | Width | Attachment Method | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Length | Width | Attachment Method | Thermal Resistance @ Natural | Material Finish | |
|
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|
ASSMANN WSW Components |
3,369
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 19X12.8MM
|
0.748" (19.00mm) | 0.504" (12.80mm) | Press Fit and PC Pin | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
1.180" (29.97mm) | 1.000" (25.40mm) | Clip and PC Pin | 18.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
1.180" (29.97mm) | 1.000" (25.40mm) | Clip and PC Pin | 18.00°C/W | Tin |
