- Material：
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- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Electus conditionibus;
Odonata Lepidoptera products 36
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid，Thermal Division of Boyd Corporation |
51,138
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLK
|
- | Board Level | Aluminum | Rectangular，Fins | 0.700" (17.78mm) | 1.750" (44.45mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 5.00°C/W @ 500 LFM | 15.60°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
11,699
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
|
- | Top Mount | Copper | Rectangular, Fins | 0.590" (14.99mm) | 1.020" (25.91mm) | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 5.00°C/W @ 400 LFM | - | Tin | ||
|
|
|
Wakefield-Vette |
5,350
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Adhesive | BGA | 0.250" (6.35mm) | 5.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
7,342
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIP-ON BLK
|
235 | Board Level | Aluminum | Rectangular, Fins | 0.850" (21.59mm) | 1.000" (25.40mm) | Bolt On | TO-220 | 0.500" (12.70mm) | 6.80°C/W @ 400 LFM | 20.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
8,818
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 PWR CLR .700"
|
- | Board Level | Aluminum | Rectangular, Fins | 0.701" (17.80mm) | 0.779" (19.80mm) | Bolt On | TO-220 | 0.850" (21.60mm) | 6.00°C/W @ 300 LFM | 15.60°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
5,077
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 LIGHTWEIGHT .5"
|
- | Board Level | Aluminum | Rectangular, Fins | 0.710" (18.03mm) | 1.000" (25.40mm) | Bolt On | TO-220 | 0.500" (12.70mm) | 4.00°C/W @ 700 LFM | 20.30°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,278
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TAB BLACK
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.070" (27.18mm) | 1.024" (26.00mm) | Bolt On and PC Pin | TO-220 | 0.315" (8.00mm) | 3.00°C/W @ 700 LFM | 15.00°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
3,457
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.250" (6.35mm) | 5.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
7,732
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .61" TO-220
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.159" (29.44mm) | 1.005" (25.53mm) | Clip and PC Pin | TO-220 | 0.610" (15.49mm) | 6.00°C/W @ 600 LFM | 13.60°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
5,706
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 STAGGERED FIN
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.210" (30.73mm) | 0.875" (22.22mm) | Bolt On and PC Pin | TO-220 | 0.250" (6.35mm) | 6.00°C/W @ 400 LFM | 16.70°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
4,209
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 100PQFP COMPOSITE
|
Deltem | Top Mount | Composite | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.400" (10.16mm) | 25.00°C/W @ 350 LFM | - | - | ||
|
|
|
Wakefield-Vette |
839
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | 5.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
642
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | 5.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
3,369
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 19X12.8MM
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.748" (19.00mm) | 0.504" (12.80mm) | Press Fit and PC Pin | TO-220 | 0.500" (12.70mm) | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
Ohmite |
297
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BLACK ANODIZED HEATSINK
|
EX | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.641" (16.28mm) | 0.642" (16.30mm) | Bolt On and Board Mounts | TO-220 | 1.000" (25.40mm) | 4.00°C/W @ 500 LFM | 16.40°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Aluminum | Rectangular, Fins | 0.710" (18.03mm) | 0.955" (24.26mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 4.00°C/W @ 700 LFM | 20.30°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Aluminum | Rectangular, Fins | 0.900" (22.86mm) | 1.000" (25.40mm) | Bolt On | TO-220 | 0.380" (9.65mm) | 4.00°C/W @ 700 LFM | 20.80°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Aluminum | Rectangular, Fins | 0.850" (21.59mm) | 1.000" (25.40mm) | Clip | TO-220, TO-262 | 0.500" (12.70mm) | 9.00°C/W @ 200 LFM | 18.80°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.850" (21.59mm) | 1.000" (25.40mm) | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 9.00°C/W @ 200 LFM | 18.80°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.159" (29.44mm) | 1.005" (25.53mm) | Clip | TO-220 | 0.610" (15.49mm) | 6.00°C/W @ 600 LFM | 13.60°C/W | Black Anodized |
