- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 12
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,325
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS 1" TALL
|
- | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 13.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,570
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS 1" TALL
|
- | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 13.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,906
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN/CLIP
|
- | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 13.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,374
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK 1"
|
- | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | Bolt On | TO-220, TO-202 | 0.500" (12.70mm) | 3.0W @ 40°C | 13.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | Bolt On | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 13.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-218, TO-247 | 0.500" (12.70mm) | 2.0W @ 30°C | 13.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 13.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 13.40°C/W | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR BGAS FIN HGT .45"
|
630 | Top Mount | Square, Pin Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | - | - | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR BGAS FIN HGT .45"
|
630 | Top Mount | Square, Pin Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Adhesive | BGA | 0.450" (11.43mm) | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Rectangular, Fins | 1.774" (45.06mm) | 1.378" (35.00mm) | Bolt On and PC Pin | TO-220 | 0.512" (13.00mm) | 3.0W @ 40°C | 10.00°C/W | ||
|
|
|
Comair Rotron |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK EXTRUD 12.7X34.9X25.4MM
|
- | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | Bolt On and PC Pin | TO-220, TO-202 | 0.500" (12.70mm) | 2.0W @ 30°C | - |
