- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
Odonata Lepidoptera products 7
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,325
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS 1" TALL
|
Board Level, Vertical | 1.000" (25.40mm) | 1.375" (34.93mm) | Bolt On and PC Pin | 0.500" (12.70mm) | 2.0W @ 30°C | 13.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,570
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/PINS 1" TALL
|
Board Level, Vertical | 1.000" (25.40mm) | 1.375" (34.93mm) | Bolt On and PC Pin | 0.500" (12.70mm) | 2.0W @ 30°C | 13.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,906
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN/CLIP
|
Board Level, Vertical | 1.000" (25.40mm) | 1.375" (34.93mm) | Clip and PC Pin | 0.500" (12.70mm) | 2.0W @ 30°C | 13.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | 1.000" (25.40mm) | 1.375" (34.93mm) | Bolt On | 0.500" (12.70mm) | 2.0W @ 30°C | 13.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 1.000" (25.40mm) | 1.375" (34.93mm) | Bolt On and PC Pin | 0.500" (12.70mm) | 2.0W @ 30°C | 13.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 1.000" (25.40mm) | 1.375" (34.93mm) | Bolt On and PC Pin | 0.500" (12.70mm) | 2.0W @ 30°C | 13.40°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | 1.774" (45.06mm) | 1.378" (35.00mm) | Bolt On and PC Pin | 0.512" (13.00mm) | 3.0W @ 40°C | 10.00°C/W |
