- Series：
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- Material：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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- Electus conditionibus;
Odonata Lepidoptera products 8
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
8,455
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB .25
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On and PC Pin | TO-220 | 0.250" (6.35mm) | 1.5W @ 50°C | 16.00°C/W @ 200 LFM | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
1,683
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK
|
- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | TO-220 | 0.250" (6.35mm) | - | 15.80°C/W @ 200 LFM | Black Anodized | |||
|
|
|
ASSMANN WSW Components |
2,266
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | TO-220 | 0.250" (6.35mm) | - | - | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
452
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK TO-220 .250" COMPACT
|
- | Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | TO-220 | 0.250" (6.35mm) | 1.5W @ 50°C | 10.00°C/W @ 500 LFM | Black Anodized | ||
|
|
|
American Technical Ceramics |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.015" (0.38mm) | - | - | - | ||
|
|
|
American Technical Ceramics |
956
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.015" (0.38mm) | - | - | - | ||
|
|
|
American Technical Ceramics |
956
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR
|
Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.040" (1.02mm) | 0.020" (0.51mm) | SMD Pad | - | 0.015" (0.38mm) | - | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Top Mount | Aluminum | Rectangular, Fins | 1.450" (36.83mm) | 0.530" (13.46mm) | Thermal Tape, Adhesive (Not Included) | 28-DIP | 0.190" (4.83mm) | 2.5W @ 80°C | 10.00°C/W @ 700 LFM | Black Anodized |
