- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Electus conditionibus;
Odonata Lepidoptera products 5
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
8,455
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB .25
|
Board Level, Vertical | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On and PC Pin | TO-220 | 0.250" (6.35mm) | 1.5W @ 50°C | 16.00°C/W @ 200 LFM | ||
|
|
Advanced Thermal Solutions Inc. |
1,683
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK
|
Board Level | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | TO-220 | 0.250" (6.35mm) | - | 15.80°C/W @ 200 LFM | |||
|
|
|
ASSMANN WSW Components |
2,266
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
Board Level | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | TO-220 | 0.250" (6.35mm) | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
452
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK TO-220 .250" COMPACT
|
Board Level | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | TO-220 | 0.250" (6.35mm) | 1.5W @ 50°C | 10.00°C/W @ 500 LFM | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Top Mount | 1.450" (36.83mm) | 0.530" (13.46mm) | Thermal Tape, Adhesive (Not Included) | 28-DIP | 0.190" (4.83mm) | 2.5W @ 80°C | 10.00°C/W @ 700 LFM |
