- Material：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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Odonata Lepidoptera products 2
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Length | Width | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
9,535
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TIN CLIP-ON 13MM
|
Board Level | Copper | 0.780" (19.81mm) | 0.520" (13.21mm) | 0.515" (13.08mm) | 1.5W @ 50°C | 28.30°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | 0.500" (12.70mm) | 2.0W @ 40°C | 18.00°C/W |
