- Material：
-
- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 90
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
ASSMANN WSW Components |
18,400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
- | Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | - | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | ||
|
|
|
ASSMANN WSW Components |
18,715
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
- | Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | - | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | ||
|
|
|
ASSMANN WSW Components |
18,715
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
|
- | Top Mount | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | - | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,250
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,300
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,300
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
16,283
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D2PAK
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
9,699
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D-PAK
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,750
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,764
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,648
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
6,648
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,216
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .45" D2PAK
|
- | Top Mount | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
11,699
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
|
- | Top Mount | Copper | Rectangular, Fins | 0.590" (14.99mm) | 1.020" (25.91mm) | - | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,117
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 TAB TIN
|
- | Board Level, Vertical | - | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 13.00°C/W | ||
|
|
|
ASSMANN WSW Components |
1,010
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | - | SMD Pad | TO-263 (D2Pak) | 0.390" (9.91mm) | - | - | 23.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
15,536
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375"TO-220
|
- | Board Level, Vertical | Copper | Rectangular, Fins | 0.750" (19.05mm) | 0.750" (19.05mm) | - | Bolt On and PC Pin | TO-220 | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 25.80°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,250
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,255
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W |
