- Series：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 3
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
ASSMANN WSW Components |
1,562
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ANOD ALUM W/PIN TO-220
|
- | Board Level, Vertical | Rectangular, Fins | Bolt On | TO-220 | 0.787" (19.99mm) | - | 10.00°C/W | ||
|
|
|
ASSMANN WSW Components |
1,944
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD W/PIN TO-220
|
- | Board Level, Vertical | Rectangular, Fins | Bolt On and PC Pin | TO-220 | 0.551" (14.00mm) | - | 12.50°C/W | ||
|
|
Advanced Thermal Solutions Inc. |
87
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 32MM X 13MM
|
maxiGRIP | Top Mount | Rectangular, Angled Fins | Clip | Flip Chip Processors | 0.512" (13.00mm) | 6.50°C/W @ 200 LFM | - |
