- Series：
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- Material：
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- Shape：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Electus conditionibus;
Odonata Lepidoptera products 10,408
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Wakefield-Vette |
4,845
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
625 | Top Mount | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | 12.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
1,953
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 15.30°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
222
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 7.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.295" (7.50mm) | - | 8.60°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
3,361
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25.4MM X 25.4MM X 4MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.157" (4.00mm) | - | 9.00°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
809
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 19.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.984" (25.00mm) | Clip, Thermal Material | BGA | 0.768" (19.50mm) | - | 3.80°C/W @ 200 LFM | - | Black Anodized | |||
|
|
|
ASSMANN WSW Components |
9,032
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.448" (11.40mm) | Bolt On and PC Pin | TO-220 | 0.260" (6.60mm) | - | - | 36.00°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
3,658
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.625" (16.00mm) | Bolt On | SOT-32, TO-220 | 0.630" (16.00mm) | - | - | 9.00°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
2,442
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Aluminum | Rectangular, Fins | 0.472" (12.00mm) | Bolt On | TO-220 | 0.256" (6.50mm) | - | - | 40.00°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
1,562
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ANOD ALUM W/PIN TO-220
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.260" (32.00mm) | Bolt On | TO-220 | 0.787" (19.99mm) | - | - | 10.00°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
3,636
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ H=.45" BLK
|
625 | Top Mount | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | - | 8.00°C/W @ 400 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
1,151
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 25X25X10MM L-TAB CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 0.984" (25.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | - | 18.36°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
|
Wakefield-Vette |
719
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 18X25MM TO-247 TO-264
|
OmniKlip | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.710" (18.03mm) | Clip, Solder Foot | TO-247, TO-264 | 1.500" (38.10mm) | - | - | - | Black Anodized | ||
|
|
|
Ohmite |
477
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 WITH 1 CLIP
|
C | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | Clip and PC Pin | TO-247 | 0.710" (18.03mm) | 5.0W @ 60°C | 6.00°C/W @ 350 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
270
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 14.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | 8.10°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
913
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 14.5MM
|
- | Top Mount | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | 8.80°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
511
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 17.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | - | 3.90°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
|
ASSMANN WSW Components |
1,462
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD TO-220
|
- | Board Level | Aluminum | Rectangular, Fins | 0.550" (13.97mm) | Bolt On | TO-220 | 0.590" (15.00mm) | - | - | 20.00°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
1,993
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | Aluminum | Rectangular, Fins | 0.472" (12.00mm) | Bolt On | TO-220 | 0.177" (4.50mm) | - | - | 60.00°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
1,944
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD W/PIN TO-220
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.260" (32.00mm) | Bolt On and PC Pin | TO-220 | 0.551" (14.00mm) | - | - | 12.50°C/W | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
1,035
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level, Vertical | Aluminum | Square, Fins | 0.984" (25.00mm) | Clip and Board Mounts | TO-220 | 0.335" (8.50mm) | - | - | 18.00°C/W | Tin |
