- Series:
-
- Material:
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- Shape:
-
- Width:
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- Attachment Method:
-
- Package Cooled:
-
- Height Off Base (Height of Fin):
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
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- Material Finish:
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- Electus conditionibus;
Odonata Lepidoptera products 19,657
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Advanced Thermal Solutions Inc. |
394
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 17.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.772" (45.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | 1.60°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
284
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 24.5MM
|
- | Top Mount | Aluminum | Square, Fins | 1.772" (45.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 2.10°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
128
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 45X45X9.5MM
|
fanSINK, maxiGRIP | Top Mount | Aluminum | Square, Pin Fins | 1.772" (45.00mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | 2.20°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
342
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X25MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.772" (45.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 3.48°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
202
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Pin Fins | 1.772" (45.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | 9.20°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
565
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 17.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.772" (45.00mm) | Clip, Thermal Material | BGA | 0.689" (17.50mm) | 1.60°C/W @ 200 LFM | - | Blue Anodized | ||||
Wakefield-Vette |
997
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ANCHOR HEATSINK 45X45X12MM
|
Wave 4x | Board Level | Aluminum Alloy | Square, Angled Fins | 1.772" (45.00mm) | Clip | BGA | 0.472" (12.00mm) | 2.96°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
996
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 7.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.772" (45.00mm) | Clip, Thermal Material | BGA | 0.295" (7.50mm) | 4.00°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
1,012
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK T766
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.772" (45.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.492" (12.50mm) | 2.10°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
539
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 12.5MM
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.772" (45.00mm) | Clip, Thermal Material | BGA | 0.492" (12.50mm) | 2.10°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
780
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45X45X17.5MM T766
|
maxiGRIP, maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 1.772" (45.00mm) | Clip, Thermal Material | BGA | 0.689" (17.50mm) | 1.60°C/W @ 200 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
34
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X20MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.772" (45.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | 4.68°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
47
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X35MM R-TAB CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.772" (45.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 1.378" (35.00mm) | 2.35°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
86
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 19.5MM
|
- | Top Mount | Aluminum | Square, Pin Fins | 1.772" (45.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | 3.00°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
40
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X6MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.772" (45.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.236" (6.00mm) | 18.11°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
90
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X10MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.772" (45.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 10.48°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
73
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X10MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.772" (45.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 10.90°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X12MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.772" (45.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.472" (12.00mm) | 9.06°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
82
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X15MM XCUT CP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.772" (45.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | 6.54°C/W @ 100 LFM | - | Blue Anodized | ||||
Advanced Thermal Solutions Inc. |
49
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X10MM XCUT FP
|
pushPIN | Top Mount | Aluminum | Square, Fins | 1.772" (45.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 20.17°C/W @ 100 LFM | - | Blue Anodized |