- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
Odonata Lepidoptera products 523
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Shape | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Shape | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Material Finish | |
|
Advanced Thermal Solutions Inc. |
128
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 45X45X9.5MM
|
fanSINK, maxiGRIP | Square, Pin Fins | 1.772" (45.00mm) | Clip, Thermal Material | BGA | 2.20°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
202
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 9.5MM
|
- | Square, Pin Fins | 1.772" (45.00mm) | Thermal Tape, Adhesive (Included) | BGA | 9.20°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
79
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X9.5MM XCUT SFP
|
pushPIN | Rectangular, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 28.22°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
37
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 9.5MM
|
- | Square, Fins | 1.772" (45.00mm) | Thermal Tape, Adhesive (Included) | BGA | 8.40°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X40X9.5MM XCUT T766
|
pushPIN | Rectangular, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 28.22°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
90
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X40X9.5MM XCUT T766
|
pushPIN | Rectangular, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 28.22°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
48
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 9.5MM
|
maxiGRIP | Square, Fins | 1.772" (45.00mm) | Clip, Thermal Material | BGA | 8.40°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X40X9.5MM XCUT T766
|
pushPIN | Rectangular, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 28.22°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
97
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 9.5MM
|
maxiGRIP, maxiFLOW | Square, Angled Fins | 1.772" (45.00mm) | Clip, Thermal Material | BGA | 4.00°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X9.5MM XCUT SFP
|
pushPIN | Rectangular, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 28.19°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X9.5MM XCUT SFP
|
pushPIN | Rectangular, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 28.32°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X9.5MM W/OUT TIM
|
- | Square, Fins | 1.772" (45.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 8.40°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X9.5MM W/OUT TIM
|
- | Square, Pin Fins | 1.772" (45.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 9.20°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X40X9.5MM XCUT
|
pushPIN | Rectangular, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 28.19°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X40X9.5MM XCUT
|
pushPIN | Rectangular, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 28.19°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X40X9.5MM XCUT
|
pushPIN | Rectangular, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 28.19°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X40X9.5MM XCUT
|
pushPIN | Rectangular, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 28.19°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X40X9.5MM XCUT
|
pushPIN | Rectangular, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 28.19°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X40X9.5MM XCUT
|
pushPIN | Rectangular, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 28.19°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X40X9.5MM XCUT
|
pushPIN | Rectangular, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 28.19°C/W @ 100 LFM | Blue Anodized |
