- Series：
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- Operating Temperature：
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- Material：
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- Length：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 84
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
42,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.157" (4.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
43,476
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.157" (4.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
43,476
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.157" (4.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
14,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
15,449
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
15,449
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
ITT Cannon，LLC |
19,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
20,553
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
20,553
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
9,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
9,266
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
9,266
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
3,067
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
3,067
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
593
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 6.5X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.256" (6.50mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,700
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 4X457.2MM SQ
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Square | 18.000" (457.20mm) | 0.157" (4.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
103
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 4X457.2MM SQ
|
- | - | Fabric Over Foam | - | Square | 18.000" (457.20mm) | 0.157" (4.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
648
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 15X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.591" (15.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
334
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
D-SHAPE
|
- | - | Fabric Over Foam | - | D-Shape | 18.000" (457.20mm) | 0.433" (11.00mm) | - | - | Adhesive |
