- Operating Temperature：
-
- Material：
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- Length：
-
- Width：
-
- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 54
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
19,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
20,553
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
20,553
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
593
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 6.5X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.256" (6.50mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,700
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 4X457.2MM SQ
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Square | 18.000" (457.20mm) | 0.157" (4.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
103
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 4X457.2MM SQ
|
- | Fabric Over Foam | - | Square | 18.000" (457.20mm) | 0.157" (4.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
648
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 15X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.591" (15.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
334
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
D-SHAPE
|
- | Fabric Over Foam | - | D-Shape | 18.000" (457.20mm) | 0.433" (11.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
628
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 10X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.394" (10.00mm) | - | - | Adhesive | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
42
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 8X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.315" (8.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 5X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.197" (5.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RECTANGLE
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.315" (8.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
D-SHAPE
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 18.000" (457.20mm) | 0.433" (11.00mm) | - | - | Adhesive | ||
|
|
TE Connectivity AMP Connectors |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER NICKEL 2.49MM
|
- | Shield Finger | Copper Alloy | - | 0.276" (7.00mm) | 0.098" (2.50mm) | Nickel | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
9,272
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER NICKEL 2.49MM
|
- | Shield Finger | Copper Alloy | - | 0.276" (7.00mm) | 0.098" (2.50mm) | Nickel | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
46,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
- | Shield Finger | - | - | - | 0.098" (2.50mm) | Tin | 100μin (2.54μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
47,689
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
- | Shield Finger | - | - | - | 0.098" (2.50mm) | Tin | 100μin (2.54μm) | Solder |
