- Series：
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- Operating Temperature：
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- Material：
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- Length：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 84
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
115
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 39.370" (1.00m) | 0.394" (10.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Laird Technologies EMI |
628
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 10X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.394" (10.00mm) | - | - | Adhesive | ||
|
|
|
Wurth Electronics Inc. |
90
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 8MMX1M DSHAPE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | D-Shape | 39.370" (1.00m) | 0.315" (8.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
32
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 39.370" (1.00m) | 0.315" (8.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
28
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 39.370" (1.00m) | 0.236" (6.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
92
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 39.370" (1.00m) | 0.827" (21.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.236" (6.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
546
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.236" (6.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
546
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.236" (6.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
42
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 8X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.315" (8.00mm) | - | - | Adhesive | ||
|
|
|
Wurth Electronics Inc. |
18
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 15MMX1M RECT
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 39.370" (1.00m) | 0.591" (15.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
3
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 5MMX1M RECT
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 39.370" (1.00m) | 0.197" (5.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
10
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | D-Shape | 39.370" (1.00m) | 0.394" (10.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 5X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.197" (5.00mm) | - | - | Adhesive |
