- Series：
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- Operating Temperature：
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- Material：
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- Shape：
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- Length：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 38
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
75,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.197" (5.00mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.197" (5.00mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.197" (5.00mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
36,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
40,874
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
40,874
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
4,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
4,411
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
4,411
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.159" (4.05mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
7,802
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.159" (4.05mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
7,802
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.159" (4.05mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
10,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMI SHIELD FINGER T&R(2000/R)
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Tin | 98.43μin (2.50μm) | Solder | ||
|
|
|
Harwin Inc. |
11,509
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMI SHIELD FINGER T&R(2000/R)
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Tin | 98.43μin (2.50μm) | Solder | ||
|
|
|
Harwin Inc. |
16,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
16,136
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
16,136
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,944
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,944
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder |
