Odonata Lepidoptera products 17
Image part manufacturer quantitas partus tempus Unit Price buy Description Type Material Shape Length Width Plating Plating - Thickness Attachment Method
120220-0204
ITT Cannon,LLC
75,600
III dies
-
MOQ: 1  MPQ: 1
UNIVERSAL CONTACT 3.5MM SMD
Shield Finger,Pre-Loaded Beryllium Copper - 0.197" (5.00mm) 0.043" (1.10mm) Nickel 118.11μin (3.00μm) Solder
120220-0204
ITT Cannon,LLC
78,446
III dies
-
MOQ: 1  MPQ: 1
UNIVERSAL CONTACT 3.5MM SMD
Shield Finger,Pre-Loaded Beryllium Copper - 0.197" (5.00mm) 0.043" (1.10mm) Nickel 118.11μin (3.00μm) Solder
120220-0204
ITT Cannon,LLC
78,446
III dies
-
MOQ: 1  MPQ: 1
UNIVERSAL CONTACT 3.5MM SMD
Shield Finger,Pre-Loaded Beryllium Copper - 0.197" (5.00mm) 0.043" (1.10mm) Nickel 118.11μin (3.00μm) Solder
120220-0314
ITT Cannon,LLC
36,000
III dies
-
MOQ: 1  MPQ: 1
MICRO UNIVERSAL CONTACT Z 3.5MM
Shield Finger,Pre-Loaded Titanium Copper - 0.149" (3.79mm) 0.038" (0.96mm) Nickel 118.11μin (3.00μm) Solder
120220-0314
ITT Cannon,LLC
40,874
III dies
-
MOQ: 1  MPQ: 1
MICRO UNIVERSAL CONTACT Z 3.5MM
Shield Finger,Pre-Loaded Titanium Copper - 0.149" (3.79mm) 0.038" (0.96mm) Nickel 118.11μin (3.00μm) Solder
120220-0314
ITT Cannon,LLC
40,874
III dies
-
MOQ: 1  MPQ: 1
MICRO UNIVERSAL CONTACT Z 3.5MM
Shield Finger,Pre-Loaded Titanium Copper - 0.149" (3.79mm) 0.038" (0.96mm) Nickel 118.11μin (3.00μm) Solder
4594PA51H01800
Laird Technologies EMI
96
III dies
-
MOQ: 1  MPQ: 1
GASKET FAB/FOAM 8.9X457.2MM RECT
Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 18.000" (457.20mm) 0.350" (8.90mm) - - Adhesive
1447009-8
TE Connectivity AMP Connectors
20,000
III dies
-
MOQ: 1  MPQ: 1
SHIELDFINGER3525Z
Shield Finger Copper Alloy - 0.177" (4.50mm) 0.098" (2.50mm) Gold 1.967μin (0.05μm) Solder
1447009-8
TE Connectivity AMP Connectors
20,581
III dies
-
MOQ: 1  MPQ: 1
SHIELDFINGER3525Z
Shield Finger Copper Alloy - 0.177" (4.50mm) 0.098" (2.50mm) Gold 1.967μin (0.05μm) Solder
1447009-8
TE Connectivity AMP Connectors
20,581
III dies
-
MOQ: 1  MPQ: 1
SHIELDFINGER3525Z
Shield Finger Copper Alloy - 0.177" (4.50mm) 0.098" (2.50mm) Gold 1.967μin (0.05μm) Solder
1447009-7
TE Connectivity AMP Connectors
16,000
III dies
-
MOQ: 1  MPQ: 1
SHIELD FINGER 3525
Shield Finger - - 0.177" (4.50mm) 0.098" (2.50mm) - - Solder
1447009-7
TE Connectivity AMP Connectors
16,671
III dies
-
MOQ: 1  MPQ: 1
SHIELD FINGER 3525
Shield Finger - - 0.177" (4.50mm) 0.098" (2.50mm) - - Solder
10118532-003RLF
Amphenol FCI
Quaestiones
-
-
MOQ: 1  MPQ: 1
ANTENNA 3.5H TI CU G/F P
Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.197" (5.00mm) 0.055" (1.40mm) Gold Flash Solder
10104321-009RLF
Amphenol FCI
Quaestiones
-
-
MOQ: 1  MPQ: 1
3.50MM HEIGHT UNIVERSAL CONTACT
Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.197" (5.00mm) 0.043" (1.10mm) Gold Flash Solder
4594PA51H01200
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
GK NICU PTAFG PU V0 REC
Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 12.000" (304.80mm) 0.350" (8.90mm) - - Adhesive
4594AB51K03937
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
GK NICU NRS PU V0 REC
Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) Rectangle 39.370" (100.00cm) 0.350" (8.90mm) - - -
10076432-009RLF
Amphenol FCI
Quaestiones
-
-
MOQ: 1  MPQ: 1
SPRINT CONTACT GOLD
Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.197" (5.00mm) 0.043" (1.10mm) Gold Flash Solder