manufacturer:
Series:
Plating - Thickness:
Attachment Method:
Odonata Lepidoptera products 144
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Operating Temperature Type Material Shape Height Width Plating Plating - Thickness Attachment Method
8863-0110-89
Laird Technologies EMI
1,831
III dies
-
MOQ: 1  MPQ: 1
OSTRSD ECE089
- - Fabric Over Foam Polyurethane Foam,Nylon Round - 0.070" (1.70mm) - - -
97022102
Laird Technologies EMI
157
III dies
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 3.18X304.8MM
- - - - - - 0.125" (3.18mm) - - -
97065402
Laird Technologies EMI
156
III dies
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 1.6X304.8MM
- - - - - - 0.063" (1.60mm) - - -
97065502
Laird Technologies EMI
221
III dies
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 1.7X304.8MM
- - - - - - 0.067" (1.70mm) - - -
97053702
Laird Technologies EMI
315
III dies
-
MOQ: 1  MPQ: 1
GASKET BECU 28.7X304.8MM
- 121°C Fingerstock Beryllium Copper - 0.410" (10.41mm) 1.130" (28.70mm) - - Adhesive
97097202
Laird Technologies EMI
1,428
III dies
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 1.6X304.8MM
- - - - - - 0.063" (1.60mm) - - -
97065517
Laird Technologies EMI
333
III dies
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 1.7X304.8MM
- - - - - - 0.067" (1.70mm) - - -
21124373
Laird Technologies EMI
25
III dies
-
MOQ: 1  MPQ: 1
MF LOAD SERIES 1/4X12
ECCOSORB - Absorbing Sheet - Round - 0.250" (6.35mm) - - -
4212PA51H01200
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
GK NICU PTAFG PU V0 SQ
- - Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Square 0.197" (5.00mm) 0.197" (5.00mm) - - Adhesive
0D97065402
Laird Technologies EMI
1
III dies
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 1.6X304.8MM
- - Fingerstock Beryllium Copper - 0.055" (1.40mm) 0.183" (4.65mm) Unplated - Clip
97054502
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
GASKET BECU 28.7X304.8MM
- 121°C Fingerstock Beryllium Copper - 0.410" (10.41mm) 1.130" (28.70mm) - - Adhesive
97053717
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
GASKET BECU 28.7X304.8MM
- 121°C Fingerstock Beryllium Copper - 0.410" (10.41mm) 1.130" (28.70mm) Tin 299.21μin (7.60μm) Adhesive
6-31CPG-BD-12
Leader Tech Inc.
67
III dies
-
MOQ: 1  MPQ: 1
COPPER BERYLLIUM FINGERSTOCK EMI
- - Fingerstock Beryllium Copper - - 0.310" (7.87mm) - - -
6-31CPG-SN-12
Leader Tech Inc.
99
III dies
-
MOQ: 1  MPQ: 1
COPPER BERYLLIUM FINGERSTOCK EMI
- - Fingerstock Beryllium Copper - - 0.310" (7.87mm) Tin - -
4283PA51H01200
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
GK NICU PTAFG PU V0 DSH
- - Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) D-Shape 0.079" (2.00mm) 0.157" (4.00mm) - - Adhesive
4912PA51H01200
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
GK NICU PTAFG PU V0 DSH
- - Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) D-Shape 0.091" (2.30mm) 0.150" (3.80mm) - - Adhesive
4053PA51H01200
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
GK NICU PTAFG PU V0 DSH
- - Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) D-Shape 0.091" (2.30mm) 0.091" (2.30mm) - - Adhesive
4184PA51H01200
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
GK NICU PTAFG PU V0 DSH
- - Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) D-Shape 0.059" (1.50mm) 0.150" (3.80mm) - - Adhesive
4223PA51H01200
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
GK NICU PTAFG PU V0 REC
- - Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 0.039" (1.00mm) 0.157" (4.00mm) - - Adhesive
4245PA51H01200
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
GK NICU PTAFG PU V0 REC
- - Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 0.039" (1.00mm) 0.118" (3.00mm) - - Adhesive