- Operating Temperature:
-
- Material:
-
- Height:
-
- Width:
-
- Plating:
-
- Plating - Thickness:
-
- Attachment Method:
-
- Electus conditionibus;
Odonata Lepidoptera products 28
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
157
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 3.18X304.8MM
|
- | - | - | - | 0.125" (3.18mm) | - | - | - | ||||
Laird Technologies EMI |
156
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | - | - | - | 0.063" (1.60mm) | - | - | - | ||||
Laird Technologies EMI |
221
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.7X304.8MM
|
- | - | - | - | 0.067" (1.70mm) | - | - | - | ||||
Laird Technologies EMI |
315
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 28.7X304.8MM
|
121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.130" (28.70mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
1,428
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | - | - | - | 0.063" (1.60mm) | - | - | - | ||||
Laird Technologies EMI |
333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.7X304.8MM
|
- | - | - | - | 0.067" (1.70mm) | - | - | - | ||||
Laird Technologies EMI |
1
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | Fingerstock | Beryllium Copper | 0.055" (1.40mm) | 0.183" (4.65mm) | Unplated | - | Clip | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 28.7X304.8MM
|
121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.130" (28.70mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 28.7X304.8MM
|
121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Leader Tech Inc. |
67
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.310" (7.87mm) | - | - | - | ||||
Leader Tech Inc. |
99
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.310" (7.87mm) | Tin | - | - | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA
|
121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,RA
|
121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 0.780" (19.81mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,SNB,CLO
|
- | - | - | - | 0.062" (1.59mm) | - | - | - | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,NIE,CLO
|
- | - | - | - | 0.062" (1.59mm) | - | - | - | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,NIB,CLO
|
- | - | - | - | 0.062" (1.59mm) | - | - | - | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,SNB,CLO
|
- | - | - | - | 0.183" (4.65mm) | - | - | - | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,ZNC,CLO
|
- | - | - | - | 0.183" (4.65mm) | - | - | - | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
|
121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU CF PROF V0
|
- | Fabric Over Foam | - | 0.060" (1.52mm) | 5.000" (127.00mm) | - | - | - |