manufacturer:
Series:
Plating - Thickness:
Attachment Method:
Odonata Lepidoptera products 144
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Operating Temperature Type Material Shape Height Width Plating Plating - Thickness Attachment Method
41-113FSV-BD-12
Leader Tech Inc.
Quaestiones
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MOQ: 1  MPQ: 1
0.41 X 1.13 X BD 12--FOLDED SERI
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.410" (10.41mm) 1.130" (28.70mm) Unplated - Adhesive
41-113FS-SN-12
Leader Tech Inc.
Quaestiones
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-
MOQ: 1  MPQ: 1
0.41 X 1.13 SN 12--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.410" (10.41mm) 1.130" (28.70mm) Tin Flash Adhesive
6-31CPG-SNPB-12
Leader Tech Inc.
Quaestiones
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-
MOQ: 1  MPQ: 1
0.06 X 0.305 SNPB 12.0--6-31CPG-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.060" (1.52mm) 0.310" (7.87mm) Lead,Tin Flash Adhesive
7-13U-AU-12
Leader Tech Inc.
Quaestiones
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-
MOQ: 1  MPQ: 1
0.07 X 0.13 AU 12--7-13U-AU-12--
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 0.130" (3.30mm) Gold Flash Adhesive