- Operating Temperature：
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- Material：
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- Shape：
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- Height：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 230
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,BF,USFT
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.200" (5.08mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 CSH
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | C-Fold | 0.402" (10.20mm) | 0.429" (10.90mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF PSA
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.760" (19.30mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.760" (19.30mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIS,USFT,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.300" (7.62mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FLX,STR,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 0.195" (4.95mm) | Tin | 299.21μin (7.60μm) | Snap-In | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FLX,STR,SU
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 0.195" (4.95mm) | - | - | Snap-In | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FLX,STR,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.260" (6.60mm) | Tin | 299.21μin (7.60μm) | Snap-In | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU PTAFG PU V0 DSH
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.500" (12.70mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.310" (7.87mm) | 0.670" (17.02mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNSAT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.210" (5.33mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SU,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.600" (15.24mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.400" (10.16mm) | 0.980" (24.89mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNSAT,PSA,POR
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,ZNY,PSA,POR
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.340" (8.64mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIB,PSA,POR
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.340" (8.64mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,CDY,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 0.780" (19.81mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNPB,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Lead，Tin | 299.21μin (7.60μm) | Adhesive |
