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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 230
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF USFT PSA
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.760" (19.30mm) | - | 299.21μin (7.60μm) | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
.100"H X .400"W 24"L--TRIANGLE--
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Triangle | 0.100" (2.54mm) | 0.400" (10.16mm) | - | - | - | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTCK ULTRASFT 8.64X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.340" (8.64mm) | - | - | - | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.20 SN 24--3-20T-SN-24--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.200" (5.08mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.23 BD 24 NTP--3-S-23T-B
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.08 SN 24--TWIST RIGHT A
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.080" (2.03mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 NI 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 1.090" (27.69mm) | Nickel | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.23 NI 24--3-23T-NI-24--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Nickel | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.23 SN 24--3-S-23T-SN-24
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.23 SN 24 NTP--3-S-23T-S
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.34 BD 24--6-34T-BD-24--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.340" (8.64mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.14 BD 24--TWIST RIGHT A
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.140" (3.56mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.08 NI 24--TWIST RIGHT A
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.080" (2.03mm) | Nickel | Flash | Adhesive | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL BF USF PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.760" (19.30mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.34 BD 24--6-S-34T-BD-24
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.060" (1.52mm) | 0.340" (8.64mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.34 BD 24--TWIST RIGHT A
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.060" (1.52mm) | 0.340" (8.64mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.06 X 0.50 BD 24--TWIST DOUBLE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.060" (1.52mm) | 0.500" (12.70mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.30 SN 24--6-30T-SN-24--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.060" (1.52mm) | 0.300" (7.62mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.30 NI 24--6-30T-NI-24--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.060" (1.52mm) | 0.300" (7.62mm) | Nickel | Flash | Adhesive |
