- Type：
-
- Material：
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- Height：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 7
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
2,273
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CARD GUI CLIPON BECU 2.03X9.53MM
|
121°C | Fingerstock | Beryllium Copper | 0.062" (1.57mm) | 0.084" (2.13mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
6,601
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 2.03X9.53MM
|
- | Fingerstock | Beryllium Copper | 0.084" (2.13mm) | 0.256" (6.50mm) | Unplated | - | Clip | ||
|
|
|
Laird Technologies EMI |
1,437
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CARD GUI CLIPON BECU 3.05X9.53MM
|
- | - | - | - | 0.120" (3.05mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
405
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 24MMX406.4MM
|
121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 0.940" (23.88mm) | - | - | Hardware，Rivet，Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CGCLIP,NIB,CLO
|
121°C | Fingerstock | Beryllium Copper | 0.194" (4.93mm) | 0.084" (2.13mm) | Nickel | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CGCLIP,SNB,CLO
|
121°C | Fingerstock | Beryllium Copper | 0.194" (4.93mm) | 0.084" (2.13mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CGCLIP,NIE,CLO
|
121°C | Fingerstock | Beryllium Copper | 0.194" (4.93mm) | 0.084" (2.13mm) | Nickel | 299.21μin (7.60μm) | Clip |
