- Plating:
-
- Plating - Thickness:
-
- Attachment Method:
-
- Electus conditionibus;
Odonata Lepidoptera products 5
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
2,273
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CARD GUI CLIPON BECU 2.03X9.53MM
|
0.062" (1.57mm) | 0.084" (2.13mm) | - | - | Clip | ||||
Laird Technologies EMI |
405
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 24MMX406.4MM
|
0.250" (6.35mm) | 0.940" (23.88mm) | - | - | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CGCLIP,NIB,CLO
|
0.194" (4.93mm) | 0.084" (2.13mm) | Nickel | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CGCLIP,SNB,CLO
|
0.194" (4.93mm) | 0.084" (2.13mm) | Tin | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CGCLIP,NIE,CLO
|
0.194" (4.93mm) | 0.084" (2.13mm) | Nickel | 299.21μin (7.60μm) | Clip |