- Material:
-
- Shape:
-
- Plating:
-
- Plating - Thickness:
-
- Attachment Method:
-
- Electus conditionibus;
Odonata Lepidoptera products 10
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
ITT Cannon,LLC |
75,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
Shield Finger,Pre-Loaded | Beryllium Copper | - | 0.138" (3.50mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
Shield Finger,Pre-Loaded | Beryllium Copper | - | 0.138" (3.50mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
Shield Finger,Pre-Loaded | Beryllium Copper | - | 0.138" (3.50mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
Leader Tech Inc. |
1,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | - | ||||
Leader Tech Inc. |
3,595
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | - | ||||
Leader Tech Inc. |
3,595
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | - | ||||
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
ANTENNA 3.5H TI CU G/F P
|
Shield Finger,Pre-Loaded | Beryllium Copper Alloy | - | 0.138" (3.50mm) | 0.055" (1.40mm) | Gold | Flash | Solder | ||||
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
3.50MM HEIGHT UNIVERSAL CONTACT
|
Shield Finger,Pre-Loaded | Beryllium Copper Alloy | - | 0.138" (3.50mm) | 0.043" (1.10mm) | Gold | Flash | Solder | ||||
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT GOLD
|
Shield Finger,Pre-Loaded | Copper Alloy | - | 0.161" (4.10mm) | 0.055" (1.40mm) | Gold | Flash | Solder | ||||
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRINT CONTACT GOLD
|
Shield Finger,Pre-Loaded | Beryllium Copper Alloy | - | 0.138" (3.50mm) | 0.043" (1.10mm) | Gold | Flash | Solder |