- Series：
-
- Type：
-
- Material：
-
- Shape：
-
- Height：
-
- Length：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Electus conditionibus;
Odonata Lepidoptera products 2,103
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
183,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
95,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
238,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
156,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
160,470
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
160,470
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
75,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
35,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 2.9X1.5MM
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
37,980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 2.9X1.5MM
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
37,980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 2.9X1.5MM
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Harwin Inc. |
36,050
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
36,232
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | Tin | 118.11μin (3.00μm) | Solder |
