- Operating Temperature：
-
- Material：
-
- Shape：
-
- Length：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Electus conditionibus;
Odonata Lepidoptera products 20
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
75,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.197" (5.00mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.197" (5.00mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.197" (5.00mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
36,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
40,874
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
40,874
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
96
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 8.9X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.350" (8.90mm) | - | - | Adhesive | ||
|
|
TE Connectivity AMP Connectors |
20,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER3525Z
|
- | Shield Finger | Copper Alloy | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
20,581
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER3525Z
|
- | Shield Finger | Copper Alloy | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
20,581
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER3525Z
|
- | Shield Finger | Copper Alloy | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
16,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 3525
|
- | Shield Finger | - | - | 0.177" (4.50mm) | 0.098" (2.50mm) | - | - | Solder | |||
|
|
TE Connectivity AMP Connectors |
16,671
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 3525
|
- | Shield Finger | - | - | 0.177" (4.50mm) | 0.098" (2.50mm) | - | - | Solder | |||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
125
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
125
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | Solder | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
ANTENNA 3.5H TI CU G/F P
|
- | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | - | 0.197" (5.00mm) | 0.055" (1.40mm) | Gold | Flash | Solder | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
3.50MM HEIGHT UNIVERSAL CONTACT
|
- | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | - | 0.197" (5.00mm) | 0.043" (1.10mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU PTAFG PU V0 REC
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 12.000" (304.80mm) | 0.350" (8.90mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 REC
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangle | 39.370" (100.00cm) | 0.350" (8.90mm) | - | - | - | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRINT CONTACT GOLD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | - | 0.197" (5.00mm) | 0.043" (1.10mm) | Gold | Flash | Solder |
