- Series：
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- Shape：
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- Attachment Method：
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Odonata Lepidoptera products 6
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
656
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 2MMX1M DSHAPE
|
WE-LT | Fabric Over Foam | Polyurethane Foam，Rayon Paper | D-Shape | 0.059" (1.50mm) | 39.370" (1.00m) | - | - | Non-Conductive Adhesive | ||
|
|
|
Harwin Inc. |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.059" (1.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,301
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.059" (1.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,301
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.059" (1.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
53
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 2MMX1M SQ
|
WE-LT | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Round | - | 39.370" (1.00m) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
58
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 2MMX1M DSHAPE
|
WE-LT | Fabric Over Foam | Polyurethane Foam，Rayon Paper | D-Shape | 0.079" (2.00mm) | 39.370" (1.00m) | - | - | Non-Conductive Adhesive |
