manufacturer:
Attachment Method:
Odonata Lepidoptera products 63
Image part manufacturer quantitas partus tempus Unit Price buy Description Type Material Shape Length Width Plating Plating - Thickness Attachment Method
120220-0161
ITT Cannon,LLC
156,000
III dies
-
MOQ: 1  MPQ: 1
UNIVERSAL CONTACT 2.5MM SMD
Shield Finger,Pre-Loaded Beryllium Copper - 0.192" (4.87mm) 0.043" (1.10mm) Gold 5.906μin (0.15μm) Solder
120220-0161
ITT Cannon,LLC
160,470
III dies
-
MOQ: 1  MPQ: 1
UNIVERSAL CONTACT 2.5MM SMD
Shield Finger,Pre-Loaded Beryllium Copper - 0.192" (4.87mm) 0.043" (1.10mm) Gold 5.906μin (0.15μm) Solder
120220-0161
ITT Cannon,LLC
160,470
III dies
-
MOQ: 1  MPQ: 1
UNIVERSAL CONTACT 2.5MM SMD
Shield Finger,Pre-Loaded Beryllium Copper - 0.192" (4.87mm) 0.043" (1.10mm) Gold 5.906μin (0.15μm) Solder
120220-0312
ITT Cannon,LLC
498,400
III dies
-
MOQ: 1  MPQ: 1
MICRO UNIVERSAL CONTACT Z 2.5MM
Shield Finger,Pre-Loaded Titanium Copper - 0.144" (3.66mm) 0.038" (0.96mm) Nickel 118.11μin (3.00μm) Solder
120220-0312
ITT Cannon,LLC
499,117
III dies
-
MOQ: 1  MPQ: 1
MICRO UNIVERSAL CONTACT Z 2.5MM
Shield Finger,Pre-Loaded Titanium Copper - 0.144" (3.66mm) 0.038" (0.96mm) Nickel 118.11μin (3.00μm) Solder
120220-0312
ITT Cannon,LLC
499,117
III dies
-
MOQ: 1  MPQ: 1
MICRO UNIVERSAL CONTACT Z 2.5MM
Shield Finger,Pre-Loaded Titanium Copper - 0.144" (3.66mm) 0.038" (0.96mm) Nickel 118.11μin (3.00μm) Solder
4082PA51H01800
Laird Technologies EMI
731
III dies
-
MOQ: 1  MPQ: 1
GASKET FAB/FOAM 9.5X457.2MM RECT
Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 18.000" (457.20mm) 0.374" (9.50mm) - - Adhesive
4633PA51H01800
Laird Technologies EMI
981
III dies
-
MOQ: 1  MPQ: 1
GASKT FAB/FOAM 7.62X457.2MM BELL
Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Bell 18.000" (457.20mm) 0.299" (7.60mm) - - Adhesive
4612PA51H01800
Laird Technologies EMI
361
III dies
-
MOQ: 1  MPQ: 1
GASKT FAB/FOAM 12.7X457.2MM RECT
Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 18.000" (457.20mm) 0.500" (12.70mm) - - Adhesive
4633PA51G01800
Laird Technologies EMI
181
III dies
-
MOQ: 1  MPQ: 1
GASKT FAB/FOAM 7.62X457.2MM BELL
Fabric Over Foam - Bell 18.000" (457.20mm) 0.299" (7.60mm) - - Adhesive
SMG098118R-0.098
Leader Tech Inc.
2,100
III dies
-
MOQ: 1  MPQ: 1
SURFACE MOUNT GASKET
Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.098" (2.50mm) 0.118" (3.00mm) - - -
SMG098118R-0.098
Leader Tech Inc.
4,150
III dies
-
MOQ: 1  MPQ: 1
SURFACE MOUNT GASKET
Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.098" (2.50mm) 0.118" (3.00mm) - - -
SMG098118R-0.098
Leader Tech Inc.
4,150
III dies
-
MOQ: 1  MPQ: 1
SURFACE MOUNT GASKET
Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.098" (2.50mm) 0.118" (3.00mm) - - -
4240PA51H01800
Laird Technologies EMI
765
III dies
-
MOQ: 1  MPQ: 1
GASKT FAB/FOAM 7.62X457.2MM DSHP
Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) D-Shape 18.000" (457.20mm) 0.299" (7.60mm) - - Adhesive
4240PA51G01800
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
D-SHAPE
Fabric Over Foam - D-Shape 18.000" (457.20mm) 0.299" (7.60mm) - - Adhesive
S9001-05R
Harwin Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
SMT PRESSURE CONTACT 1300/RL
Shield Finger - - 0.138" (3.50mm) 0.079" (2.00mm) Gold Flash Solder
S9001-05R
Harwin Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
SMT PRESSURE CONTACT 1300/RL
Shield Finger - - 0.138" (3.50mm) 0.079" (2.00mm) Gold Flash Solder
S9001-05R
Harwin Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
SMT PRESSURE CONTACT 1300/RL
Shield Finger - - 0.138" (3.50mm) 0.079" (2.00mm) Gold Flash Solder
S9001-46R
Harwin Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
SMT PRESSURE CONTACT TIN 1300
Shield Finger - - 0.138" (3.50mm) 0.079" (2.00mm) Tin Flash Solder
S9001-46R
Harwin Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
SMT PRESSURE CONTACT TIN 1300
Shield Finger - - 0.138" (3.50mm) 0.079" (2.00mm) Tin Flash Solder