- Material：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 6
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Material | Height | Length | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Material | Height | Length | Plating | Attachment Method | |
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | Gold | Solder | ||
|
|
|
Laird Technologies EMI |
3,499
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | Gold | Solder | ||
|
|
|
Laird Technologies EMI |
3,499
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | Gold | Solder | ||
|
|
Leader Tech Inc. |
22,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
Phosphor Bronze | 0.137" (3.48mm) | 0.310" (7.87mm) | Tin | - | |||
|
|
Leader Tech Inc. |
23,160
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
Phosphor Bronze | 0.137" (3.48mm) | 0.310" (7.87mm) | Tin | - | |||
|
|
Leader Tech Inc. |
23,160
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
Phosphor Bronze | 0.137" (3.48mm) | 0.310" (7.87mm) | Tin | - |
