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- Material：
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- Electus conditionibus;
Odonata Lepidoptera products 2,066
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
183,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
95,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
238,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
156,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
160,470
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
160,470
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
75,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
35,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 2.9X1.5MM
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
37,980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 2.9X1.5MM
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
37,980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 2.9X1.5MM
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
7,010
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 5.1X457.2MM RECT
|
Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.039" (1.00mm) | 18.000" (457.20mm) | 0.201" (5.10mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
2,468
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 3X457.2MM RECT
|
Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.079" (2.00mm) | 18.000" (457.20mm) | 0.118" (3.00mm) | - | - | Adhesive |
