- Series：
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- Shape：
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- Height：
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- Length：
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- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 47
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
36,050
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
36,232
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
36,232
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
4,900
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
5,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
5,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT TIN 1300
|
- | Shield Finger | - | - | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT TIN 1300
|
- | Shield Finger | - | - | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT TIN 1300
|
- | Shield Finger | - | - | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
Leader Tech Inc. |
22,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
- | Shield Clip | Phosphor Bronze | - | 0.137" (3.48mm) | 0.310" (7.87mm) | 0.090" (2.28mm) | - | - | |||
|
|
Leader Tech Inc. |
23,160
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
- | Shield Clip | Phosphor Bronze | - | 0.137" (3.48mm) | 0.310" (7.87mm) | 0.090" (2.28mm) | - | - | |||
|
|
Leader Tech Inc. |
23,160
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
- | Shield Clip | Phosphor Bronze | - | 0.137" (3.48mm) | 0.310" (7.87mm) | 0.090" (2.28mm) | - | - | |||
|
|
TE Connectivity AMP Connectors |
46,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
- | Shield Finger | - | - | 0.157" (4.00mm) | - | 0.098" (2.50mm) | 100μin (2.54μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
47,689
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
- | Shield Finger | - | - | 0.157" (4.00mm) | - | 0.098" (2.50mm) | 100μin (2.54μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
47,689
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
- | Shield Finger | - | - | 0.157" (4.00mm) | - | 0.098" (2.50mm) | 100μin (2.54μm) | Solder | |||
|
|
Leader Tech Inc. |
476
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | - | Adhesive | |||
|
|
Leader Tech Inc. |
78
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 0.550" (13.97mm) | - | Adhesive | |||
|
|
Leader Tech Inc. |
97
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.180" (4.57mm) | - | Adhesive | |||
|
|
Leader Tech Inc. |
99
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | - | - | |||
|
|
Leader Tech Inc. |
99
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | - | 12.000" (304.80mm) | 0.310" (7.87mm) | - | - |
