Plating - Thickness:
Odonata Lepidoptera products 557
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Material Height Length Width Plating Plating - Thickness Attachment Method
98052019
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
AP,STR,NIB,USFT,PSA
- Beryllium Copper 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Nickel 299.21μin (7.60μm) Adhesive
98091302
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
S3,STR,BF,USF,RIV
- Beryllium Copper 0.220" (5.59mm) 15.000" (381.00mm) 0.620" (15.75mm) - - Rivet
98054201
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
NOSG,STR,BF,USFT
Foldover Beryllium Copper 0.080" (2.03mm) 16.000" (406.40mm) 0.250" (6.35mm) - - -
0C98051502
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
NOSG COIL BF USF PSA
Foldover Beryllium Copper 0.230" (5.84mm) 24.000" (609.60mm) 0.760" (19.30mm) Unplated - Adhesive
98065517
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
PCLIP,STR,SNB,USF,CLO
- Beryllium Copper 0.305" (7.75mm) 11.945" (303.40mm) - Tin 299.21μin (7.60μm) Clip
98095808
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
S3,STR,SNSAT,USFT,RIV
- Beryllium Copper 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) Tin 299.21μin (7.60μm) Adhesive
0C97044018
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
CSTR COIL NIE
Large Enclosure Beryllium Copper 0.410" (10.41mm) 25.000 (7.62m) 1.630" (41.40mm) Nickel 299.21μin (7.60μm) Hardware,Rivet,Solder
98091617
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
S3,STR,SNB,USFT,RIVIT
- Beryllium Copper 0.140" (3.56mm) 15.000" (381.00mm) 0.450" (11.43mm) Tin 299.21μin (7.60μm) Adhesive
98095519
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
S3,STR,NIB,USFT,RIV
- Beryllium Copper 0.140" (3.56mm) 15.000" (381.00mm) 0.450" (11.43mm) Tin 299.21μin (7.60μm) Adhesive
98053717
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
AP,STR,SNB,USFT,PSA
- Beryllium Copper 0.410" (10.41mm) 12.000" (304.80mm) 1.130" (28.70mm) Tin 299.21μin (7.60μm) Adhesive
0C98044002
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
CSTR COIL BF USF
Large Enclosure Beryllium Copper 0.410" (10.41mm) 25.000 (7.62m) 1.630" (41.40mm) Unplated - Adhesive
98095217
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
S3,STR,SNB,USFT,RIV
- Beryllium Copper 0.220" (5.59mm) 15.000" (381.00mm) 0.620" (15.75mm) Tin 299.21μin (7.60μm) Rivet
98094102
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
FLX,STR,BF,USFT
- Beryllium Copper 0.170" (4.32mm) 24.000" (609.60mm) 0.195" (4.95mm) - - Snap-In
98091902
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
S3,STR,BF,USFT,RIV
- Beryllium Copper 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) - - Rivet
0C97043816
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
CSTR COIL ZNY
Large Enclosure Beryllium Copper 0.250" (6.35mm) 25.000 (7.62m) 1.090" (27.69mm) Zinc + Yellow Chromate 299.21μin (7.60μm) Hardware,Rivet,Solder
98051517
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
NOSG,STR,SNB,USFT,PSA
Foldover Beryllium Copper 0.230" (5.84mm) 24.000" (609.60mm) 0.760" (19.30mm) Tin 299.21μin (7.60μm) Adhesive
0C97052005
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
AP COIL CDY PSA
All-Purpose Beryllium Copper 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Cadmium + Yellow Chromate 299.21μin (7.60μm) Adhesive