Plating - Thickness:
Odonata Lepidoptera products 557
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Material Height Length Width Plating Plating - Thickness Attachment Method
97065002
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
FINGERSTOCK BECU 25X406.4MM
- Beryllium Copper 0.400" (10.16mm) 24.000" (609.60mm) 0.980" (24.89mm) - - Clip
97092102
Laird Technologies EMI
7
III dies
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MOQ: 1  MPQ: 1
FINGERSTOCK BECU 6.6X609.6MM
- Beryllium Copper 0.230" (5.84mm) 24.000" (609.60mm) 0.260" (6.60mm) - - Snap-In
97095217
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
FINGERSTOCK BECU 15.82X381MM
- Beryllium Copper 0.220" (5.59mm) 15.000" (381.00mm) 0.620" (15.75mm) Tin 299.21μin (7.60μm) Rivet
97053717
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
GASKET BECU 28.7X304.8MM
- Beryllium Copper 0.410" (10.41mm) 12.000" (304.80mm) 1.130" (28.70mm) Tin 299.21μin (7.60μm) Adhesive
0C97055902
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
Twist Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.300" (7.62mm) Unplated - Adhesive
0C97055502
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
Twist Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Unplated - Adhesive
0C98055902
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
Twist Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.300" (7.62mm) Unplated - Adhesive
0C97043802
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
Large Enclosure Beryllium Copper 0.250" (6.35mm) 25.000 (7.62m) 1.090" (27.69mm) - - Hardware,Rivet,Solder
0C97054002
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
- Beryllium Copper 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Unplated - Adhesive
0C97054017
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
- Beryllium Copper 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Tin 299.21μin (7.60μm) Adhesive
0C97054019
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
- Beryllium Copper 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel 299.21μin (7.60μm) Adhesive
97056102
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
FINGERSTOCK BECU 12.7X609.6MM
Twist Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.500" (12.70mm) - - Adhesive
97052502
Laird Technologies EMI
53
III dies
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MOQ: 1  MPQ: 1
.140X.370 GASKET FABRIC O/ FOAM
- Beryllium Copper 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) - - Adhesive
78002017
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
SLMT,2F,SNB,USFT
Slot Mount Beryllium Copper 0.220" (5.59mm) 0.532" (13.51mm) 0.600" (15.24mm) Tin 299.21μin (7.60μm) Slot
77001508
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
SLMT,1F,SNSAT
Slot Mount Beryllium Copper 0.220" (5.59mm) 0.250" (6.35mm) 0.600" (15.24mm) Tin 299.21μin (7.60μm) Slot
77001509
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
SLMT,1F,NID
Slot Mount Beryllium Copper 0.220" (5.59mm) 0.250" (6.35mm) 0.600" (15.24mm) Nickel 299.21μin (7.60μm) Slot
77001515
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
SLMT,1F,ZNC
Slot Mount Beryllium Copper 0.220" (5.59mm) 0.250" (6.35mm) 0.600" (15.24mm) Zinc + Clear Chromate 299.21μin (7.60μm) Slot
77001516
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
SLMT,1F,ZNY
Slot Mount Beryllium Copper 0.220" (5.59mm) 0.250" (6.35mm) 0.600" (15.24mm) Zinc + Yellow Chromate 299.21μin (7.60μm) Slot
77001615
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
SLMT,1F,ZNC
Slot Mount Beryllium Copper 0.110" (2.79mm) 0.169" (4.29mm) 0.320" (8.13mm) Zinc + Clear Chromate 299.21μin (7.60μm) Slot
77001617
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
SLMT,1F,SNB
Slot Mount Beryllium Copper 0.110" (2.79mm) 0.169" (4.29mm) 0.320" (8.13mm) Tin 299.21μin (7.60μm) Slot