- Operating Temperature：
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- Material：
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- Height：
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- Length：
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- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 294
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
90,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.067" (1.70mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
90,634
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.067" (1.70mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
90,634
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.067" (1.70mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Flash | Solder | ||
|
|
|
ITT Cannon，LLC |
156,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | 5.906μin (0.15μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
160,470
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | 5.906μin (0.15μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
160,470
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | 5.906μin (0.15μm) | Solder | ||
|
|
|
Harwin Inc. |
42,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.157" (4.00mm) | 0.157" (4.00mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
43,476
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.157" (4.00mm) | 0.157" (4.00mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
43,476
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.157" (4.00mm) | 0.157" (4.00mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
14,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | 0.157" (4.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
15,449
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | 0.157" (4.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
15,449
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | 0.157" (4.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
63,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 6MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.236" (6.00mm) | 0.157" (4.00mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
64,160
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 6MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.236" (6.00mm) | 0.157" (4.00mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
64,160
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 6MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.236" (6.00mm) | 0.157" (4.00mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
15,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 5.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.219" (5.57mm) | 0.274" (6.95mm) | 0.114" (2.90mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
17,594
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 5.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.219" (5.57mm) | 0.274" (6.95mm) | 0.114" (2.90mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
17,594
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 5.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.219" (5.57mm) | 0.274" (6.95mm) | 0.114" (2.90mm) | Flash | Solder | ||
|
|
|
Molex，LLC |
64,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
72,070
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | 19.685μin (0.50μm) | Solder |
