- Material：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Electus conditionibus;
Odonata Lepidoptera products 6
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Height | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Height | Width | Plating - Thickness | Attachment Method | |
|
TE Connectivity AMP Connectors |
120,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHILEDFINGER1210EMBOSSPACKING
|
Shield Finger，Pre-Loaded | - | 0.041" (1.05mm) | 0.047" (1.20mm) | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
128,582
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHILEDFINGER1210EMBOSSPACKING
|
Shield Finger，Pre-Loaded | - | 0.041" (1.05mm) | 0.047" (1.20mm) | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
128,582
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHILEDFINGER1210EMBOSSPACKING
|
Shield Finger，Pre-Loaded | - | 0.041" (1.05mm) | 0.047" (1.20mm) | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
8,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
1.1H SPRING FINGER W/EMBOSS
|
Shield Finger，Pre-Loaded | Copper Alloy | 0.043" (1.10mm) | 0.039" (1.00mm) | Flash | Solder | |||
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEADER
|
- | Stainless Steel | - | - | - | - | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SPRING PROBE 1POS SMD
|
- | Brass | - | - | 19.7μin (0.50μm) | - |
