- Operating Temperature：
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- Material：
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- Height：
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- Length：
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- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 294
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.138" (3.50mm) | 0.159" (4.05mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
7,802
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.138" (3.50mm) | 0.159" (4.05mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
7,802
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.138" (3.50mm) | 0.159" (4.05mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
7,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.177" (4.50mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
10,632
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.177" (4.50mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
10,632
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.177" (4.50mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
16,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
16,136
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
16,136
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
1,750
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | - | Shield Finger | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
2,087
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | - | Shield Finger | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
2,087
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | - | Shield Finger | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
3,067
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
3,067
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.276" (7.00mm) | 0.244" (6.20mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,349
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.276" (7.00mm) | 0.244" (6.20mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,349
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.276" (7.00mm) | 0.244" (6.20mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Molex Connector Corporation |
9,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ANTI SNAG SPRING CONT 1.0UM GLD
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.043" (1.10mm) | 0.138" (3.50mm) | 0.039" (1.00mm) | 39.370μin (1.00μm) | Solder | ||
|
|
|
Molex Connector Corporation |
9,283
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ANTI SNAG SPRING CONT 1.0UM GLD
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.043" (1.10mm) | 0.138" (3.50mm) | 0.039" (1.00mm) | 39.370μin (1.00μm) | Solder |
