- Operating Temperature:
-
- Material:
-
- Height:
-
- Length:
-
- Width:
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- Plating - Thickness:
-
- Attachment Method:
-
- Electus conditionibus;
Odonata Lepidoptera products 294
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | ||
Molex Connector Corporation |
9,283
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ANTI SNAG SPRING CONT 1.0UM GLD
|
- | - | Shield Finger,Pre-Loaded | Stainless Steel | 0.043" (1.10mm) | 0.138" (3.50mm) | 0.039" (1.00mm) | 39.370μin (1.00μm) | Solder | ||||
Harwin Inc. |
30,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger,Pre-Loaded | Copper Alloy | 0.050" (1.28mm) | 0.098" (2.50mm) | 0.039" (1.00mm) | Flash | Solder | ||||
Harwin Inc. |
37,436
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger,Pre-Loaded | Copper Alloy | 0.050" (1.28mm) | 0.098" (2.50mm) | 0.039" (1.00mm) | Flash | Solder | ||||
Harwin Inc. |
37,436
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger,Pre-Loaded | Copper Alloy | 0.050" (1.28mm) | 0.098" (2.50mm) | 0.039" (1.00mm) | Flash | Solder | ||||
Harwin Inc. |
12,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.079" (2.00mm) | 0.181" (4.60mm) | 0.110" (2.80mm) | Flash | Solder | ||||
Harwin Inc. |
13,779
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.079" (2.00mm) | 0.181" (4.60mm) | 0.110" (2.80mm) | Flash | Solder | ||||
Harwin Inc. |
13,779
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.079" (2.00mm) | 0.181" (4.60mm) | 0.110" (2.80mm) | Flash | Solder | ||||
Harwin Inc. |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger,Pre-Loaded | Copper Alloy | 0.051" (1.30mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Flash | Solder | ||||
Harwin Inc. |
8,394
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger,Pre-Loaded | Copper Alloy | 0.051" (1.30mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Flash | Solder | ||||
Harwin Inc. |
8,394
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger,Pre-Loaded | Copper Alloy | 0.051" (1.30mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Flash | Solder | ||||
Harwin Inc. |
2,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.75MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.108" (2.75mm) | 0.246" (6.25mm) | 0.125" (3.18mm) | Flash | Solder | ||||
Harwin Inc. |
3,537
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.75MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.108" (2.75mm) | 0.246" (6.25mm) | 0.125" (3.18mm) | Flash | Solder | ||||
Harwin Inc. |
3,537
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.75MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.108" (2.75mm) | 0.246" (6.25mm) | 0.125" (3.18mm) | Flash | Solder | ||||
Wurth Electronics Inc. |
4,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.224" (5.70mm) | 0.185" (4.70mm) | 0.079" (2.00mm) | Flash | Solder | ||||
Wurth Electronics Inc. |
4,584
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.224" (5.70mm) | 0.185" (4.70mm) | 0.079" (2.00mm) | Flash | Solder | ||||
Wurth Electronics Inc. |
4,584
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.224" (5.70mm) | 0.185" (4.70mm) | 0.079" (2.00mm) | Flash | Solder | ||||
Wurth Electronics Inc. |
1,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.209" (5.30mm) | 0.157" (4.00mm) | 0.079" (2.00mm) | Flash | Solder | ||||
Wurth Electronics Inc. |
1,637
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.209" (5.30mm) | 0.157" (4.00mm) | 0.079" (2.00mm) | Flash | Solder | ||||
Wurth Electronics Inc. |
1,637
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.209" (5.30mm) | 0.157" (4.00mm) | 0.079" (2.00mm) | Flash | Solder | ||||
Molex Connector Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.30MM - 0.55MM H
|
105384 | - | Shield Finger,Pre-Loaded | Stainless Steel | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | 19.7μin (0.50μm) | Solder |