- Operating Temperature：
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- Material：
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- Height：
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- Length：
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- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 294
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,916
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,916
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.276" (7.00mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,365
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.276" (7.00mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,365
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.276" (7.00mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Shield Clip | Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | - | Solder | ||
|
|
|
Laird Technologies EMI |
3,499
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Shield Clip | Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | - | Solder | ||
|
|
|
Laird Technologies EMI |
3,499
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Shield Clip | Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | - | Solder | ||
|
|
|
Wurth Electronics Inc. |
600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.512" (13.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
888
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.512" (13.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
888
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.512" (13.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.106" (2.70mm) | 0.150" (3.80mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.106" (2.70mm) | 0.150" (3.80mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.106" (2.70mm) | 0.150" (3.80mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.189" (4.80mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
958
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.189" (4.80mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
958
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.189" (4.80mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.236" (6.00mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
546
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.236" (6.00mm) | 0.079" (2.00mm) | Flash | Solder |
